WIRE-BONDING METHOD

申请(专利)号： JP19990216699

专利号： JP2001044236A 主分类号： H01L21/60 申请权利人： SHINKAWA LTD 公开国代码： JP 优先权国家： JP

摘 要：

PROBLEM TO BE SOLVED: To enable wire-bonding by supplying a pad having an antioxidant film formed thereon to a wire bonding process and stably obtain bonding quality, even when the antioxidant film is not formed on the pad. ;SOLUTION: A first ball 14 formed on a tail extending from a tip of a capillary 11 is pressure weldered, and ultrasonic vibration is applied to a surface of a pad 2 with an antioxidant film. An oxidant film 5 formed on the upper surface of a copper pad 4 is attached to the first ball 14. Subsequently, the first ball 14, on which the oxidation preventing film 5 is

attached, is bonded at an arbitrary site other than the bonding point and

discarded. Next, a second ball is formed on a tail, extending from the tip of the capillary 11 formed, when the first ball is removed. Then, a wire 12 is connected to the bonding point of the copper pad 4, from which the antioxidant film 5 is

removed and a lead 7 which corresponds to this copper pad 4.;COPYRIGHT: (C)2001,JPO

申请日： 1999-07-30 公开公告日： 2001-02-16

分类号： H01L21/60

发明设计人： NISHIURA SHINICHI 申请国代码： JP

优先权： 19990730 JP

21669999

摘 要 附 图：

主权项：

【請求項1】 キャピラリの先端より延在したテールに電気トーチにより放電を行って第1のボールを形成し、この第1のボールをパッドの表面に圧接及び超音波振動を印加してパッドの上面に形成された酸化防止膜又は

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说 明 书

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