Compact system and method for chemical-mechanical

专利名称：Compact system and method for chemical-mechanical polishing utilizing energycoupled to the polishing pad/waterinterface

发明人：Michael F. Chisholm,Andrew T. Appel申请号：US08/3400申请日：19941212公开号：US05522965A公开日：19960604

摘要：A compact system and method for chemical-mechanical polishing. A polishingpad (114) is attached to a non-rotating platen (112) and used to polish a wafer (116).Rotating arm (118) positions the wafer (116) over the pad (114) and applies pressure.Energy (e.g. ultrasonic) is coupled from device (122) to the platen (112). Energy is thusapplied to the pad/wafer interface to aid in the removal of surface material from wafer(116) and for pad conditioning. New slurry is added to wash the particles off the edges ofthe pad (114).

申请人：TEXAS INSTRUMENTS INCORPORATED

代理人：Jacqueline J. Garner,Jim Brady,Richard L. Donaldson

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