Die with integral pedestal having insulated walls

专利名称：Die with integral pedestal having insulated

walls

发明人：Shahram Mostafazadeh申请号：US11048182申请日：20050131公开号：US07067927B1公开日：20060627

专利附图：

摘要：A variety of techniques and structures are described that integrate an insulatedpedestal into the back surface of integrated circuit dice. The die has an insulated integralpedestal formed therein that acts as a spacer. The pedestal has a footprint that is

smaller than the total footprint of the die so that a portion of the active region of the dieoverhangs the pedestal. The geometry of the pedestal may be widely varied and in someembodiments, multiple pedestals may be provided on the stacked die. In another aspect,the pedestals are formed at the wafer level such that the pedestals are defined in theback surface of the wafer. Often, the thickness of the pedestals will be thicker than theportions of the wafer outside the pedestal areas. The described dice are particularly wellsuited for use in stacked die packages.

申请人：Shahram Mostafazadeh

地址：San Jose CA US

国籍：US

代理机构：Beyer Weaver & Thomas, LLP

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